ICETEK-C6678/XC7K325T-DCAPN High speed processing

点击：1390　时间：2023-1-1

Dual FMC interface High speed Internet

DSP+FPGA High speed processing system

ICETEK-C6678/XC7K325T-DCAPN

1. Product Overview:

ICETEK-C6678/XC7K325T-DCAPN is a high-speed DSP+FPGA high-speed processing system with dual FMC interface independently developed and produced by REALTIME Technology Co., LTD.  The system adopts DSP+FPGA dual processor mode. DSP uses TI Keystone architecture C6000 series eight-core C66x fixed-point/floating point DSP TMS320C6678ACYPA.  Xilinx Kintex-7 series FPGA XC7K32T5-2FGG900I is selected for FPGA, with 8 4Gb DDR3 memory chips, which can meet the requirements of large capacity storage while the system runs at high speed.  The core board adopts two 400PIN FMC high-speed and high-precision connectors, extending C6678 and XC7K325T data pins, which can not only connect with the ICETEK series application extension baseboard to obtain gigabit network, optical fiber, video/image, audio, LCD and other functions, but also expand more application peripheral interfaces and functions.  To meet the wider design needs of the market.

ICETEK-C6678/XC7K325T-DCAPN Dual FMC interface high-speed interconnection DSP+FPGA high-speed processing system can be more widely used in the following fields:

Industrial automation, Intelligent Internet of Things, High-performance computing systems, mission-critical systems, fiber optic communications, machine vision, high-speed image acquisition and processing, industrial image processing, security monitoring, medical imaging, automotive electronics, automation and process control, etc.

2. Features:

    ● There are EMIF and SRIO high-speed interfaces between DSP and FPGA to meet more product design requirements.

    ● The core board directly extends the FMC socket, which is more convenient to connect with various FMC modules.

    ● High-end FPGA with 900pin is selected to expand more I/O pins.

3. Hardware specifications:

    ● Block diagram:

    ● Interface diagram:

    ● Core processor components:

        ■ Xilinx Kintex-7 FPGA + TI C6678 Multi-core DSP co-processing 

    ● Interface properties:

        ■ Two 400PIN FMC conncetors

        ■ One 14PIN DSP JTAG

        ■ One 14PIN FPGA JTAG

        ■ 2 gigabit network interfaces

        ■ One 10/100M network interface

        ■ Two SFP ports

        ■ One PCIe port

        ■ 1 digital video input interface

        ■ 1 channel analog video input interface

        ■ 1 channel analog video output interface

        ■ One MIC IN audio interface

        ■ One LINE IN audio interface

        ■ One MIC OUT audio interface

        ■ One HEADPHONE audio interface

        ■ One data extension interface, 20pin

        ■ One data extension interface, 50pin

        ■ A set of high-speed data extension interface, SMA interface

        ■ One high-speed data extension interface, 20pin

        ■ 1 set of extended mode interfaces

        ■ One UART interface, 4PIN

        ■ 1 UART to USB port

        ■ One RS-232 port, 3PIN

        ■ One power adapter for connecting ports

    ● Processing performance:

        ■ DSP fixed-point arithmetic：40GMAC/Core*8=320GMAC

        ■ DSP floating point arithmetic：20GFLOPs/Core*8=160GFLOPs

        ■ FPG delay 3ns

    ● Memory property:

        ■ DSP processing node：2GByte DDR3-1333 SDRAM

        ■ DSP processing node：4GByte Nand Flash

        ■ FPGA processing node：1GByte DDR3-1600 SDRAM

    ● Interconnection performance:

        ■ DSP & FPGA：SRIO x4@5Gbps/lane；

        ■ DSP & FPGA：EMIF 18 bit address bus

        ■ DSP & FPGA：SPI connect

        ■ DSP & FPGA：IIC connect

        ■ FPGA & FMC interface：1 GTX x8@10Gbps/lane

    ● Physical and electrical characteristics:

        ■ Core Board size：116mm x 86mm

        ■ Power supply：3A max@+12V（±5%）

        ■ Heat-dissipating method：Natural air cooling heat dissipation

    ● Environmental characteristics:

        ■ Operating temperature：-40°C ~﹢85°C

        ■ Storage temperature：-55°C ~﹢125°C

        ■ Working humidity：5%~95%, non-condensation

4. Main components：

    ● DSP：TMS320C6678ACYPA

        ■ Eight TMS320C66x DSP Core Subsystems at 1.00 GHz and 1.25GHz

           - 320 GMAC/160 GFLOP @ 1.25GHz

           - 32KB L1P, 32KB L1D, 512KB L2 Per Core

           - 4MB Shared L2

        ■ Multicore Navigator and TeraNet Switch Fabric - 2 Tb

        ■ Network Coprocessors- Packet Accelerator, Security Accelerator

        ■ Four Lanes of SRIO 2.1 - 5 Gbaud Per Lane Full Duplex

        ■ Two Lanes PCIe Gen2 - 5 Gbaud Per Lane Full Duplex

        ■ HyperLink - 50Gbaud Operation, Full Duplex

        ■ Ethernet MAC Subsystem - Two SGMII Ports w/ 10/100/1000 Mbps operation

        ■ 64-Bit DDR3 Interface (DDR3-1600) - 8 GByte Addressable Memory Space

        ■ 16-Bit EMIF - Async SRAM, NAND and NOR Flash Support

        ■ Two Telecom Serial Ports (TSIP) - 2/4/8 Lanes at 32.768/16.384/8.192

        ■ UART Interface

        ■ I2C Interface

        ■ 16 GPIO Pins

        ■ SPI Interface

        ■ Sixteen 64-Bit Timers

        ■ Three On-Chip PLLs

    ● FPGA：XC7K325T-2FFG900I

        ■ Xilinx Kintex-7 FPGA

        ■ Logical unit：326,080

        ■ LAB/CLB：25475

        ■ RAM：16404480

        ■ I/O：500

        ■ Operating temperature：-40°C ~85°C

5. Dimensional drawing: