ICETEK-C6678/XC7K325T-DC High speed processing

点击：1608　时间：2023-1-1

Daul FMC interface High speed Internet

DSP+FPGA High speed processing system

ICETEK-C6678/XC7K325T-DC

1. Product Overview:

ICETEK-C6678/XC7K325T-DC is a high-speed DSP+FPGA high-speed processing system with dual FMC interface, which is independently developed and produced by REALTIME Technology Co., LTD.  The system adopts DSP+FPGA dual-processor mode. DSP uses TI Keystone architecture C6000 series eight-core C66x fixed-point/floating-point DSP TMS320C6678ACYPA.  Xilinx Kintex-7 series FPGA XC7K32T5-2FGG900I is selected for FPGA, with 8 4Gb DDR3 memory chips, which can meet the requirements of large capacity storage while the system runs at high speed.  The core board adopts two 400PIN FMC high-speed, high-precision connectors, extending C6678 and XC7K325T data pins, which can not only connect with the application expansion baseboard, but also expand more peripheral functions, so as to meet the design requirements of developers. 

ICETEK-C6678/XC7K325T-DC Dual FMC interface high-speed interconnection DSP+FPGA high-speed processing system can be more widely used in the following fields:

Industrial automation, Intelligent Internet of Things, High-performance computing systems, mission-critical systems, fiber optic communications, machine vision, high-speed image acquisition and processing, industrial image processing, security monitoring, medical imaging, automotive electronics, automation and process control, etc.

2. Features:

    ● There are EMIF and SRIO high-speed interfaces between DSP and FPGA to meet more product design requirements.

    ● The core board directly extends the FMC socket, which is more convenient to connect with various FMC modules.

    ● High-end FPGA with 900pin is selected to expand more I/O pins.

3. Hardware specifications:

    ● Block diagram:

    ● Interface diagram:

    ● Core processor components:

        ■ Xilinx Kintex-7 FPGA + TI C6678 Multi-core DSP co-processing 

    ● Interface properties:

        ■ 2 400PIN FMC connectors

        ■ 1 14PIN DSP JTAG

        ■ 1 14PIN FPGA JTAG

    ● Processing performance:

        ■ DSP fixed-point arithmetic：40GMAC/Core*8=320GMAC

        ■ DSP floating point arithmetic：20GFLOPs/Core*8=160GFLOPs

        ■ FPG delay 3ns

    ● Memory property:

        ■ DSP processing node：2GByte DDR3-1333 SDRAM

        ■ DSP processing node：4GByte Nand Flash

        ■ FPGA processing node：1GByte DDR3-1600 SDRAM

    ● Interconnection performance:

        ■ DSP & FPGA：SRIO x4@5Gbps/lane；

        ■ DSP & FPGA：EMIF 18 bit address bus

        ■ DSP & FPGA：SPI connect

        ■ DSP & FPGA：IIC connect

        ■ FPGA & FMC interface：1 GTX x8@10Gbps/lane

    ● Physical and electrical characteristics:

        ■ Board size：116mm x 86mm

        ■ Power supply：3A max@+12V（±5%）

        ■ Heat-dissipating method：Natural air cooling heat dissipation

    ● Environmental characteristics:

        ■ Operating temperature：-40°C ~﹢85°C

        ■ Storage temperature：-55°C ~﹢125°C

        ■ Working humidity：5%~95%, non-condensation

4. Main components：

    ● DSP：TMS320C6678ACYPA

        ■ Eight TMS320C66x DSP Core Subsystems at 1.00 GHz and 1.25GHz

           - 320 GMAC/160 GFLOP @ 1.25GHz

           - 32KB L1P, 32KB L1D, 512KB L2 Per Core

           - 4MB Shared L2

        ■ Multicore Navigator and TeraNet Switch Fabric - 2 Tb

        ■ Network Coprocessors- Packet Accelerator, Security Accelerator

        ■ Four Lanes of SRIO 2.1 - 5 Gbaud Per Lane Full Duplex

        ■ Two Lanes PCIe Gen2 - 5 Gbaud Per Lane Full Duplex

        ■ HyperLink - 50Gbaud Operation, Full Duplex

        ■ Ethernet MAC Subsystem - Two SGMII Ports w/ 10/100/1000 Mbps operation

        ■ 64-Bit DDR3 Interface (DDR3-1600) - 8 GByte Addressable Memory Space

        ■ 16-Bit EMIF - Async SRAM, NAND and NOR Flash Support

        ■ Two Telecom Serial Ports (TSIP) - 2/4/8 Lanes at 32.768/16.384/8.192

        ■ UART Interface

        ■ I2C Interface

        ■ 16 GPIO Pins

        ■ SPI Interface

        ■ Sixteen 64-Bit Timers

        ■ Three On-Chip PLLs

    ● FPGA：XC7K325T-2FFG900I

        ■ Xilinx Kintex-7 FPGA

        ■ Logical unit：326,080

        ■ LAB/CLB：25475

        ■ RAM：16404480

        ■ I/O：500

        ■ Operating temperature：-40°C ~85°C

5. Dimensional drawing: